Research Interests
High-Speed Infrared Imaging of Transient Temperature Fields in Solid Subjected to Dynamic Loading
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Collaborator: G. Ravichandran, Caltech
Highly dynamic failure processes often involve the generation of transient temperature fields resulting from either the conversion of plastic work into heat or from dissipation through dynamic frictional contact and sliding. These phenomena, which are often responsible for accelerating the failure process, happen under nearly adiabatic conditions and over very short time scales (microsecond time scales). In the past years we have been developing a unique instrument capable of providing two dimensional temperature images at a framing rate of one million frames per second. This high speed infrared camera prototype is now used to visualize in real time temperature fields at the vicinity of initiating and dynamically growing cracks, propagation shear bands, as well as for the investigation of frictional hot spots at the faces of dynamic shear cracks in heterogeneous solids.
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